Huawei‘s upcoming flagship SOC, the Huawei HiSilicon Kirin 980 chipset, was leaked ahead of IFA 2018 launch. Recently, the company’s CEO Richard Yu had confirmed that the new chipset would new SOC will be built on the 7 nm manufacturing process, making it the first 7nm SOC launched in the market. TSMC will manufacture the chipset.
According to the new leaks, the chipset is said to come with an Octa-core CPU with 4x Cortex A77 cores clocked at 2.8 GHz paired with 4x Cortex A55 cores with unknown clock speed. While ARM hasn’t announced the Cortex-A77 architecture, yet, it is expected to announce the launch of the new A77 cores, during IFA 2018. As of now, the ARM Cortex architecture maxes out at A76 cores.
The SOC will come with twice the number of graphics cores than the outgoing Kirin 970 chipset, with 24 GPU cores on the Mali-G72 MP24 GPU found on the Kirin 980. The SOC also supports dual channel LPDDR4X RAM.
The chipset is said to support Bluetooth 5.0 standards, with Dual-band 802.11 ac Wi-Fi. Huawei has always stressed on the integrated NPU on Kirin 970 chipset. The yet-to-be-announced chipset, Kirin 980, too is supposed to come with NPU M1 Neural Processing Unit with promise performance up to 8 TOPs. The cameras will be able to utilize the Triple ISP used in the upcoming SOC.
Huawei HiSilicon Kirin 980 Launch Date
The HiSilicon Kirin 980 chipset will be announced on August 30, at IFA 2018. The Mate 20 series smartphones will be the first smartphones to be powered by this SOC.
The specifications may differ from the actual product, as the benchmarking app used for testing isn’t completely reliable.